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HS Code 59119091 - Polishing Pads for Semiconductors

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers

Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)

Examples (No official information or warranty)

- Self-adhesive circular polishing pads, 200mm in diameter, for the manufacture of semiconductor wafers
- Circular polishing pads with a thickness of 5mm, self-adhesive, used in the production of semiconductor wafers
- Self-adhesive polishing pads of 300mm in diameter, designed for the manufacturing process of semiconductor wafers
- Polishing pads, self-adhesive, circular in shape, 400g each, used in the production of semiconductor wafers