HS Code 59119091 - semiconductor wafer polishing pads

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers
warning Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)

Examples (No official information or warranty)

- Self-adhesive circular polishing pads (diameter 10 cm, thickness 2 mm) for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter 15 cm, thickness 3 mm) for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter 20 cm, thickness 4 mm) for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter 12 cm, thickness 2.5 mm) for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter 18 cm, thickness 3.5 mm) for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter 25 cm, thickness 5 mm) for semiconductor wafer manufacture

Code Tree Structure / Hierarchy
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Hrvatski HR
Magyar HU
Português PT
Slovenčina SK
Slovenščina SL

    5911 Textile products and articles, for technical uses, specified in note 8 to this chapter 591190 Other Other 59119091 Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers 59119099 Other

Trade restrictions and policies

Customs duties, Trade restrictions and policies with validity date:
Chapter 59
58 Trade restrictions and policies
Position 5911
2 Trade restrictions and policies
Subheading 591190
1 Trade restrictions and policies
Customs Tariff Number 59119091
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Changes to this tariff number

Changes in favor of 59119091
2016: 59119090
➜
2017: 59119091