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HS Code 39199020 - Polishing Pads for Semiconductors

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics

Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)

Examples (No official information or warranty)

- Self-adhesive circular polishing pads of 10cm diameter, used for the manufacture of semiconductor wafers, made of polyethylene
- Rolls of self-adhesive circular polishing pads, 20 pads per roll, 15cm diameter, for semiconductor wafer manufacturing
- Polypropylene self-adhesive circular polishing pads, 12cm diameter, used in the production of semiconductor wafers
- Circular self-adhesive polishing pads, 8cm diameter, made of polyester, specifically designed for semiconductor wafer manufacturing
- Self-adhesive circular polishing pads of 18cm diameter, made of polyvinyl chloride (PVC), for semiconductor wafer production