HS Code 39199020 - semiconductor wafer polishing pads

Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers, of plastics
warning Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)

Examples (No official information or warranty)

- Self-adhesive circular polishing pads (diameter: 200mm, thickness: 2mm) of plastics, used for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter: 300mm, thickness: 3mm) of plastics, used for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter: 150mm, thickness: 1.5mm) of plastics, used for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter: 250mm, thickness: 2.5mm) of plastics, used for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter: 180mm, thickness: 1.8mm) of plastics, used for semiconductor wafer manufacture
- Self-adhesive circular polishing pads (diameter: 220mm, thickness: 2.2mm) of plastics, used for semiconductor wafer manufacture

Code Tree Structure / Hierarchy
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Slovenčina SK
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    3919 Self-adhesive plates, sheets, film, foil, tape, strip and other flat shapes, of plastics, whether or not in rolls 391990 Other 39199020 Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers 39199080 Other

Trade restrictions and policies

Customs duties, Trade restrictions and policies with validity date:
Chapter 39
44 Trade restrictions and policies
Position 3919
16 Trade restrictions and policies
Subheading 391990
0 Trade restrictions and policies
Customs Tariff Number 39199020
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Changes to this tariff number

Changes in favor of 39199020
2016: 39199000
➜
2017: 39199020