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Customs Tariff Number Position 8456 - Search results (15)
Machine tools with specialized processes
Machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)
Machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices, electronic integrated circuits, printed circuits, and parts of heading 8517 or of computers)
Machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning apparatus operated by ultrasonic processes, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)
Machine tools for working any material by removal of material, operated by ultrasonic processes (excl. cleaning apparatus operated by ultrasonic processes and material testing machines)
Machine tools for working any material by removal of material, operated by light or photon beam processes other than laser, of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 8517, or parts of automatic data processing machines
Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices, electronic integrated circuits, printed circuits, and parts of heading 8517 or of computers)
Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)
Machine tools for working any material by removal of material, operated by electro-discharge processes, wire-cut, numerically controlled
Machine tools for working any material by removal of material, operated by electro-discharge processes, numerically controlled (excl. such machines, wire-cut)
Machine tools for working any material by removal of material, operated by electro-discharge processes
Machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits)
Water-jet cutting machines
Machine tools for working any material by removal of material, operated by electro-discharge processes, not numerically controlled
Machine tools for working any material by removal of material, operated by plasma arc processes