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HS Code 38180090 - Doped electronics materials in forms

Chemical elements and compounds doped for use in electronics, in the form of discs, wafers, cylinders, rods or similar forms, or cut into discs, wafers or similar forms, whether or not polished or with a uniform epitaxial coating (excl. elements that have been further processed, e.g. by selective diffusion, and doped silicon)

Can be used for an export declaration.
(Combined Nomenclature, Customs Tariff Number)

Examples (No official information or warranty)

- Germanium doped with Gallium in the form of wafers, 10cm in diameter and 0.5mm thick
- Silicon Carbide doped with Nitrogen, cut into rods of 1cm in diameter and 10cm long
- Boron doped with Phosphorus in the form of discs, 5cm in diameter and 0.3mm thick
- Selenium doped with Tellurium, polished and coated with a uniform epitaxial coating, in the form of cylinders of 2cm in diameter and 5cm long
- Gallium Arsenide doped with Zinc, cut into wafers of 7.5cm in diameter and 0.8mm thick